LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

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Flip chip integrated circuit packages accommodating exposed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip interconnection pad layout

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip interconnection structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip MLP with folded heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip molded/exposed die process and package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip mounting body, flip chip mounting method and flip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip package and method of making

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip package capable of measuring bond line thickness...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip package for micromachined semiconductors

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip package including a non-planar heat spreader and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip package of monolithic microwave integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip package with improved cap design and process for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip package, circuit board thereof and packaging...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip packages with spacers separating heat sinks and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip packaging using recessed interposer terminals

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip semiconductor device with dual purpose metallized grou

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip semiconductor mounting structure with electrically con

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip with solder pre-plated leadframe including...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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