Flip chip interconnection structure

Details Flip chip interconnection structure Flip chip interconnection structure

2011-08-09

2011-08-09

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

C257S704000, C257S248000, C257S784000, C257SE21511, C438S106000

Reexamination Certificate

active

07994636

ABSTRACT:
A flip chip interconnection structure is formed by mechanically interlocking joining surfaces of a first and second element. The first element, which may be a bump on an integrated circuit chip, includes a soft, deformable material with a low yield strength and high elongation to failure. The surface of the second element, which may for example be a substrate pad, is provided with asperities into which the first element deforms plastically under pressure to form the mechanical interlock.

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