Flip chip packages with spacers separating heat sinks and...

Details Flip chip packages with spacers separating heat sinks and... Flip chip packages with spacers separating heat sinks and...

2007-10-30

2010-11-30

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S706000, C257S707000, C257S711000, C257S717000, C257SE33075, C257SE23051, C257SE23083, C257SE23084, C361S709000, C361S769000, C361S770000

Reexamination Certificate

active

07843058

ABSTRACT:
A package structure includes a substrate; a die over and flip bonded on the substrate; a heat sink over the die; and one or more spacer separating the heat sink from the substrate.

REFERENCES:
patent: 5841194 (1998-11-01), Tsukamoto
patent: 6084178 (2000-07-01), Cromwell
patent: 6909176 (2005-06-01), Wang et al.
patent: 2004/0036162 (2004-02-01), Chuang et al.
patent: 2006/0063310 (2006-03-01), Jadhav et al.
patent: 2008/0042263 (2008-02-01), Wang et al.

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