LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Enhanced heat dissipating chip scale package method and devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Enhanced leadless chip carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Enhanced probe for gathering data from semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Enhanced thermal dissipation integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Enhanced via structure for organic module performance

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Enhancement of wire bondability in semiconductor device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Environment-resistant module, micropackage and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

EPROM package and method of optically erasing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With desiccant – getter – or gas filling

ESD protection apparatus for an electrical device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Etch stop layer for silicon (Si) via etch in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Expansion constrained die stack

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Exposed die molding apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Exposed die-attach heatsink package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Exposed heat spreader with seal ring

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Exposed lead interposer leadframe package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

External electrode for a monolithic multi-layer actuator

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Externally bondable overmolded package arrangements