Expansion constrained die stack

Details Expansion constrained die stack Expansion constrained die stack

2007-02-06

2007-02-06

Soward, Ida M. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S688000, C257S689000, C257S723000, C257S725000, C257S729000, C257S777000, C257S778000

Reexamination Certificate

active

10930397

ABSTRACT:
Structures and techniques for mounting semiconductor dies are disclosed. In one embodiment, the invention includes a stack of printed wiring board assemblies that are connected via interconnection components. At least one of the printed wiring board assemblies includes an interposer substrate having a constraining layer that includes carbon.

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