Exposed die-attach heatsink package

Details Exposed die-attach heatsink package Exposed die-attach heatsink package

1991-09-27

1993-04-06

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

361386, 257712, 257720, H05K 720

Patent

active

052008096

ABSTRACT:
A technique for packaging an integrated-circuit die in a conventional molded-plastic package exposes the lead frame to which the integrated-circuit die is attached so that heat-conducting columns can be directly attached to the leadframe through vias formed in the molded plastic package. The vias expose selected areas of the lead-frame to which are attached the thermally conductive columns, which extend to an exterior surface of the molded plastic package so that the lead-frame and the conductive columns provide a path for conduction of heat from the die to the exterior of the package.

REFERENCES:
patent: 3585272 (1971-06-01), Shatz
patent: 3636415 (1972-01-01), Kruer
patent: 3930114 (1975-12-01), Hodge
patent: 5065280 (1991-11-01), Karnezos et al.

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