Externally bondable overmolded package arrangements

Details Externally bondable overmolded package arrangements Externally bondable overmolded package arrangements

1995-04-28

1997-04-08

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257680, 257762, 257766, H01L 2348, H01L 2352

Patent

active

056190689

ABSTRACT:
In a conventional overmolded leadframe package, having a multiplicity of leadframe fingers and encasing one or more electronic devices, a window is formed. The window exposes at least three selected ones of the leadframe fingers at localized sites. At these (exposed) sites of these selected ones of the leadframe fingers, these fingers are coated with a contact material such as gold, whereby localized contact sites are formed. Electrical conductors emanating from one or more external devices--such as electronic devices, electro-optic devices, or opto-electronic devices--can then be bonded to these localized contact sites. The remaining (non-selected) leadframe fingers are typically bonded to a wiring board.

REFERENCES:
patent: 4000842 (1977-01-01), Burns
patent: 4911519 (1990-03-01), Burton et al.
patent: 5294829 (1994-03-01), Hundt
patent: 5328552 (1994-07-01), Benzoni

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