LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Device packages with low stress assembly process

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Device used to produce or examine semiconductors

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Device with at least one semiconductor component and a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Device with chiplets and adaptable interconnections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Device with integrated circuit protected against attacks...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Device with power semiconductor components

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Device with power semiconductor components for controlling...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Device, system and electric element

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Devices having compliant wafer-level packages with pillars...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Devices having substrates with opening passing through the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Devices with tape automated bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Diamond composite heat spreader and associated methods

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Diamond composite heat spreader having thermal conductivity...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Diamond heat sink comprising synthetic diamond film

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Diamond heat sink including microchannel therein and methods for

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Diamond heat spreading and cooling technique for integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Diamond-silicon hybrid integrated heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount

Dicing tape and die ejection method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount

Die assemblies