Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-01-17
2006-01-17
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Reexamination Certificate
active
06987318
ABSTRACT:
A diamond composite heat spreader having a variable thermal conductivity gradient can improve control of heat transfer based on a specific application. A diamond-containing region of the heat spreader can contain diamond particles such that the diamond concentration and/or the diamond particle size a varied to produce a desired thermal conductivity gradient. Regions proximate to a heat source can have a higher thermal conductivity than regions further away from the heat source. Thin diamond films can also be used in conjunction with the particulate diamond in order to provide a region of maximum thermal conductivity adjacent a heat source. By providing a variable thermal conductivity gradient, more expensive materials such as diamond film and larger diamond particles can be selectively used in regions closer to a heat source, while allowing for cheaper smaller diamond particles and materials to be used farther away from the heat source where thermal conductivity can be lower without sacrificing overall performance.
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Pizarro-Crespo Marcos D.
Thorpe North & Western LLP
Weiss Howard
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