Diamond heat sink including microchannel therein and methods for

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257 77, 257706, 257930, H01L 2334, H01L 2306

Patent

active

058747753

ABSTRACT:
A diamond heat sink of the present invention comprises: a support layer consisting of substantially undoped diamond; a heat sensitive layer consisting of doped diamond, disposed on the surface of the support layer; an insulation layer consisting of substantially undoped diamond, disposed on a predetermined region in the surface of the heat sensitive layer; electrodes disposed on the heat sensitive layer, wherein an exothermal device is placed on the surface of the insulation layer; and a cooling structure disposed on the backside of the support layer, the cooling structure having at least one microchannel, the microchannel being defined by a diamond, wherein an exothermal device is to be placed on the surface of the insulation layer; and wherein the heat sensitive layer and the electrodes form a thermistor, the electrical resistivity of the thermistor being capable of varying corresponding to heat generated from the exothermal device and transferred through the insulation layer to the thermistor.

REFERENCES:
patent: 5309000 (1994-05-01), Saito et al.
patent: 5493131 (1996-02-01), Miyata et al.
patent: 5512873 (1996-04-01), Saito et al.
patent: 5663595 (1997-09-01), Shiomi et al.
Tuckerman et al., "High-Performance Heat Sinking for VLSI," IEEE Electron Device Letters, vol. EDL-2, No. 5, May 1981, pp. 126-129.
Mundinger et al., "Demonstration of High-Performance Silicon Microchannel Heat Exchangers for Laser Diode Array Cooling," App. Phys. Lett., 53(12), Sep. 19, 1988, pp. 1030-1032.
Missaggia et al., "Microchannel Heat Sinks for Two-Dimensional High-Power-Density Diode Laser Arrays," IEEE Journal of Quantum Electronics, vol. 25, No. 9, Sep. 1989, pp. 1988-1992.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Diamond heat sink including microchannel therein and methods for does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Diamond heat sink including microchannel therein and methods for, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Diamond heat sink including microchannel therein and methods for will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-309929

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.