Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2002-01-25
2004-10-19
Elms, Richard (Department: 2824)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S723000, C257S678000
Reexamination Certificate
active
06806562
ABSTRACT:
BACKGROUND OF THE INVENTION
FIELD OF THE INVENTION
The invention relates to a device with at least one semiconductor component and at least one printed circuit board and to a method of establishing an electromechanical connection between the two.
For connecting a semiconductor component, in particular a semiconductor component using flip-chip technology, to a printed circuit board made of ceramic or plastic, the semiconductor chip must be pressed with its solderable external contacts onto contact terminals of the printed circuit board while being heated and subjected to pressure until a soldered connection is completely established and the solder has solidified. After that, the intermediate space between the semiconductor component and the printed circuit board can, if necessary, be filled with a filling material. As long as the solder has not solidified, it is necessary to hold the semiconductor component in position, it being possible for the aligning and holding in position to lead to incorrect placements, especially if vibrations and other disturbances displace the mutually aligned components with respect to one another.
SUMMARY OF THE INVENTION
It is accordingly an object of the invention to provide a device with at least one semiconductor component and a printed circuit board and a method of establishing an electromechanical connection between the two which overcome the above-mentioned disadvantages of the prior art devices and methods of this general type, in which the risk of maladjustment of the two components to be connected to each other is reduced.
With the foregoing and other objects in view there is provided, in accordance with the invention, a device containing at least one printed circuit board having contact terminals with central blind openings, and at least one semiconductor component having external contacts connected to the contact terminals on the printed circuit board. The external contacts of the semiconductor component protrude into the central blind openings and are in a force-locking engagement or a form-locking engagement with the contact terminals.
According to the invention, the device has the semiconductor component and the printed circuit board. The semiconductor component has external contacts, which are to be connected to contact terminals on the printed circuit board. The contact terminals on the printed circuit board have central blind openings, into which the external contacts of the semiconductor component protrude and are in at least a force-locking engagement with the contact terminals. The provision of central blind openings in the contact terminals of the printed circuit board has the effect of preventing a maladjustment after the semiconductor component has been mounted onto the printed circuit board, since the external contacts of the semiconductor component protrude with a force-locking engagement into the blind openings. This also dispenses with the need for providing a clasping device that fixes the semiconductor component on the printed circuit board during a soldering operation. Furthermore, on account of the force-locking engagement, which at the same time also brings about an electrical contact, a solder-free electrical connection is achieved between the external contacts of the semiconductor component and the contact terminals of the printed circuit board, so that the mounting and electrical connecting of the semiconductor component to the printed circuit board does not require any thermal treatment on account of the contact terminals according to the invention. The position of the semiconductor component on the printed circuit board can be supported and secured for a long time not only by the force-locking engagement itself but by an adhesive filler, which is disposed between the semiconductor component and the printed circuit board. In a further embodiment of the invention, the blind openings have a bottom region with greater dimensions than its top region. The external contacts of the semiconductor component protrude through the top region of the blind opening into the contact terminals and are deformed by the pressure applied to the semiconductor component in the blind openings in such a way that they are in a form-locking engagement with the contact terminals of the printed circuit board. The form-locking engagement is ensured by the greater dimensions of the bottom region of the blind openings. A semiconductor component which is in engagement in this way with such preformed contact terminals of the printed circuit board is anchored on the printed circuit board in such a way that the filling with the aid of a filler or an adhesive disposed in between is not absolutely necessary to ensure a durable electromechanical connection.
In a further embodiment of the invention, the central blind openings in the contact terminals are formed as slots. Such slot-shaped blind openings have the advantage that, when the semiconductor chip is mounted onto the contact terminals of the printed circuit board, a greater tolerance can be allowed during alignment, and nevertheless a secure durable electromechanical connection between the semiconductor component and the printed circuit board can be ensured.
In a further embodiment of the invention, the central blind openings in the contact terminals are pillar shaped. The pillar shape may have a polygonal cross section or a circular cross section and effect with its top region, which receives the external contacts of the semiconductor component, a plastic deformation of the external contacts during mounting, so that a force-locking electromechanical connection occurs.
In a further embodiment of the invention, it is envisaged to form the central blind openings in the contact terminals as truncated cones, the base area of which is disposed on the base area of the contact terminals and the tip of which is positioned on the surface of the contact terminals. Such a truncated cone has the effect that when the semiconductor component and the printed circuit board are being fitted together that the external contacts of the semiconductor component are deformed within the blind opening in the form of a truncated cone and widen toward the base area of the truncated cone, so that a form-locking electromechanical connection is produced between the external contacts of the semiconductor component and the contact terminals of the printed circuit board.
The external contacts of the semiconductor component may have a rivet form in cross section, the rivet head being connected to the contact area of the semiconductor component and the rivet tip protruding out of the semiconductor component. The contact areas of the semiconductor component may either be disposed directly on a semiconductor chip or on a wiring film that is disposed on the active upper side of the semiconductor chip. The rivet tip protrudes out of the semiconductor component, so that the semiconductor component can be attached by the flip-chip technique on a printed circuit board and can be electromechanically connected to the contact terminals of the printed circuit board. The rivet tips of the rivet form facilitate the insertion of the external contacts into the blind openings of the contact terminals of the printed circuit board when the semiconductor component and the printed circuit board are assembled to form a device according to the invention. Depending on the formation of the blind opening in the material of the contact terminals of the printed circuit board, a force-locking engagement, for example in the case of a pillar form of the blind opening, or a form-locking engagement, for example in the case of a frustoconical form of the blind opening, can be brought about. For this purpose, the tip of the rivet form has smaller dimensions than the central blind opening of the contact terminals of the printed circuit board, while the foot region of the rivet form has greater dimensions than the blind opening of the printed circuit board. This ensures that the external contacts of the semiconductor component can be inserted relatively unproblema
Barchmann Bernd
Heinemann Erik
Heitzer Josef
Pueschner Frank
Elms Richard
Greenberg Laurence A.
Infineon - Technologies AG
Locher Ralph E.
Smith Brad
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