Devices with tape automated bonding

Details Devices with tape automated bonding Devices with tape automated bonding

1992-03-04

1994-10-11

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257786, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053550196

ABSTRACT:
Disclosed is a method for fabricating devices, and the resulting products, using Tape Automated Bonding (TAB) technology. Via holes are formed through a flexible insulating layer, such as polyimide, and are plated through when conductive fingers are formed on one surface of the layer. The resulting structure is then bonded to a semiconductor chip by means of the conductive pads formed on the surface of the insulating layer opposite to the conductive fingers.

REFERENCES:
patent: 3269861 (1966-08-01), Schneble, Jr. et al.
patent: 3791848 (1974-02-01), DeAngelo
patent: 3832769 (1974-09-01), Olyphant, Jr. et al.
patent: 3868724 (1975-02-01), Berrino
patent: 4814855 (1989-03-01), Hodgson et al.
patent: 4976808 (1990-12-01), Ogasawara
patent: 5065227 (1991-11-01), Frankeny et al.
patent: 5065228 (1991-11-01), Foster et al.
patent: 5089881 (1992-02-01), Panicker
"Integration Techniques for Electronically Active Elements and Circuits"--Hui--Technical Notes RCA.

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