Device with power semiconductor components

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

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Details

257686, 257726, 257727, H01L 2334, H01L 2302

Patent

active

058834311

ABSTRACT:
A device with power semiconductor components includes, in combination: a stack alternately comprising at least one power semiconductor component and at least one heatsink to dissipate heat and to provide an electrical connection, at least a first system for clamping the power semiconductor components, at least a second system for clamping components protecting the power semiconductor components, at least one spacer for insulating the semiconductor components from the framework of the various modules and at least one conductive block replacing heatsinks that are rendered unnecessary by the arrangement chosen for the inverter and auxiliary chopper functions.

REFERENCES:
patent: 3447118 (1969-05-01), Ferree
patent: 3603381 (1971-09-01), Scherbaum
patent: 4023616 (1977-05-01), Scherbaum
patent: 4338652 (1982-07-01), Romanczuk et al.
patent: 4347543 (1982-08-01), Frister et al.
corresponding to JP-A-56 088324 (MitsubishiDenki K.K.) 17 Jul. 1981.

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