Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2006-11-07
2006-11-07
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S621000, C257S696000, C257S773000, C257S667000, C257S798000, C257S777000, C257S784000, C257S786000, C257S783000, C257S776000, C257S775000, C361S776000, C361S774000, C361S784000, C361S773000, C174S262000, C174S260000, C174S250000, C385S014000
Reexamination Certificate
active
07132736
ABSTRACT:
Devices and methods of fabrication thereof are disclosed. A representative device includes a complaint wafer-level package having one or more lead packages. A representative lead package includes a substrate having a plurality of die pads disposed thereon and a plurality of leads attached to the plurality of die pads. In addition, the lead package includes a plurality of pillars made of a low modulus material. Each pillar is disposed between the substrate and at least one lead, and each lead is disposed upon one of the pillars that compliantly support the lead.
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Bakir Muhannad S.
Meindl James D.
Patel Chirag S.
Georgia Tech Research Corporation
Thomas Kayden Horstemeyer & Risley LLP
Williams Alexander Oscar
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