Device with chiplets and adaptable interconnections

Details Device with chiplets and adaptable interconnections Device with chiplets and adaptable interconnections

2008-11-04

2010-11-09

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S776000, C257SE23141

Reexamination Certificate

active

07830002

ABSTRACT:
An active-matrix device includes a device substrate including a plurality of pixels formed thereon, each pixel having a separate control electrode, a plurality of chiplets having at least first and second corresponding chiplets disposed at different locations over the device substrate, a plurality of wires formed over the device substrate, each wire being connected to a connection pad and to a different pixel control electrode, and wherein the shape of at least one of the wires connecting a connection pad for the first chiplet is different from the shape of at least one of the wires connecting a corresponding connection pad for the second chiplet.

REFERENCES:
patent: 6384529 (2002-05-01), Tang et al.
patent: 6879098 (2005-04-01), Buchwalter et al.
patent: 6919681 (2005-07-01), Cok et al.
patent: 6987355 (2006-01-01), Cok
patent: 7230594 (2007-06-01), Miller et al.
patent: 2006/0055864 (2006-03-01), Matsumura et al.
patent: WO 00/49658 (2000-08-01), None
patent: WO 2008/026573 (2008-03-01), None

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