Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-04-24
2009-06-16
Wilczewski, M. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S676000, C257S706000, C257S796000, C257SE23042
Reexamination Certificate
active
07547964
ABSTRACT:
A semiconductor device package includes a die pad, a substrate disposed on the die pad, and a III-nitride based semiconductor device disposed on the substrate. The device package may also include a second semiconductor device disposed on the die pad or the substrate, which device may be electrically connected to the III-nitride based device to form a circuit.
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Connah Norman Glyn
Pavier Mark
Green Telly D
International Rectifier Corporation
Ostrolenk Faber Gerb & Soffen, LLP
Wilczewski M.
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