Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount
Reexamination Certificate
2011-08-02
2011-08-02
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With housing mount
C257SE23026, C257S710000, C257S728000, C438S122000, C174S521000
Reexamination Certificate
active
07989951
ABSTRACT:
An embodiment of a die assembly includes a flange, lip walls, and leads for electrical contact with one or more die mounted on the flange. The flange has first and second opposed flange surfaces and flange sidewalls extending between the surfaces. The lip walls have first and second opposed lip surfaces and lip sidewalls extending between the first and second lip surfaces. The lip sidewalls are positioned adjacent to the flange sidewalls. The leads, which have inboard end portions and outboard end portions, are configured to preserve a seating plane. The seating plane is spaced apart from a plane of the second flange surface. The inboard end portions of the leads are embedded in the lip walls, and extend from the seating plane upward through the lip walls toward the first lip surfaces. The outboard end portions are aligned substantially within the seating plane.
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Dougherty David J.
Yeung Betty H.
Chu Chris
Freescale Semiconductor Inc.
Ingrassia Fisher & Lorenz P.C.
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