LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

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Chip module and manufacture of same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip module for complete power train

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip module with a plurality of flat contact elements...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip mounting structure having adhesive conductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip on board leadframe for semiconductor components having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip on board package for imager

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip on board package for optical mice and lens cover for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip on board package with top and bottom terminals

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip on board with heat sink attachment and assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip on glass package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip on photosensitive device package structure and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip package and electrical connection structure between...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip package and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip package and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip package and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip package and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip package and process for forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip package and substrate thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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