Chip module for complete power train

Details Chip module for complete power train Chip module for complete power train

2006-06-30

2010-02-02

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S531000, C257S723000, C257S778000

Reexamination Certificate

active

07656024

ABSTRACT:
A chip module is disclosed. It includes a circuit substrate, a semiconductor die comprising a power transistor mounted on the circuit substrate, and a passive electronic component. The passive electronic component is in electrical communication with the semiconductor die, and is in thermal communication with the semiconductor die.

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