Arrangement having at least one electronic component
Assembly for dissipatating heat from a semiconductor chip wherei
Assembly for dissipating heat from a stacked semiconductor packa
Assembly for mounting power semiconductive modules to heat...
Ball grid array housing having a cooling foil
Ball grid array housing having a cooling foil
Ball grid array package enhanced with a thermal and...
Ball grid array package that includes a collapsible spacer...
Ball grid array package that includes a collapsible spacer...
Ball grid array package with conductive leads
Ball grid array package with enhanced thermal and electrical cha
Ball grid array package with inexpensive threaded secure locking
Ball grid array packages with thermally conductive containers
Ball grid array type printed wiring board having exellent...
Base for heat sink
Bonding of silicon carbide chip with a semiconductor
Bypass capacitor embedded flip chip package lid and stiffener
Carbon nanotube-based structures and methods for removing...
Carbonaceous composite heat spreader and associated methods
Carrier module