Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-05-02
1999-11-16
Loke, Steven H.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257675, 257697, 257698, 257706, 257780, 257707, H01L 2334, H01L 23495, H01L 2348, H01L 2304
Patent
active
059863404
ABSTRACT:
A ball grid array (BGA) package incorporating a heat dissipating member which includes a thin die attach portion mounted between an integrated circuit chip (die) and a package substrate, a heat sink portion surrounding the die attach portion, and tie bars connected between the die attach portion and the heat sink portion. The die attach portion is thinner than the heat sink portion such that a recessed area is formed for receiving an integrated circuit die. Heat generated by a die mounted on the die attach portion is transmitted to the heat sink portion along the tie bars, thereby providing enhanced thermal characteristics. Inductive effects on signals passing between the integrated circuit die and a host printed circuit board are reduced by connecting the heat dissipating member to a ground potential. A Faraday cage is formed around the integrated circuit die by mounting a metal plate on the upper peripheral surface of the heat sink portion.
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Mostafazadeh Shahram
Smith Joseph O.
Choi Glen B.
Kwok Edward C.
Loke Steven H.
National Semiconductor Corporation
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