Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-03-08
2005-03-08
Chang, Richard (Department: 3729)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S706000, C257S718000, C257S719000, C257S727000, C029S890030, C029S890035, C029S890038, C029S890040, C029S890045, C029S832000, C029S836000, C029S837000, C029S838000, C029S739000, C029S740000, C029S741000
Reexamination Certificate
active
06864572
ABSTRACT:
A heat sink base (10) includes a rectangular body (11) made of aluminum and a circular core (12) made of copper. The body defines a circular through opening (111). A diameter of the opening is slightly less than a diameter of the core. The core is attached within the body according to the following steps: a) pressing the core into the through opening of the body; b) stamping the core to cause it to plastically deform in radial directions and thereby become firmly combined with the body; and c) removing any burring of the core flowing out from the opening such that surfaces of the core and the body are coplanarly smooth.
REFERENCES:
patent: 5313099 (1994-05-01), Tata et al.
Deng Wen Qiu
Fu Xue Jin
Lee Cheng Chi
Liu Zheng Liang
Chang Richard
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
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