Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2008-01-01
2008-01-01
Smoot, Stephen W. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Reexamination Certificate
active
10885965
ABSTRACT:
A ball grid array package is manufactured by mounting a semiconductor die to a first surface of a substrate and mounting a die adapter to the semiconductor die. The semiconductor die is wire bonded to ones of conductive traces of the substrate. A collapsible spacer is mounted to the substrate and the substrate is releasably clamped to an upper side of a mold cavity. A heat spreader and at least one collapsible spacer are placed in the mold cavity such that the collapsible spacer is disposed between the heat spreader and the substrate. A molding compound is molded in the mold, thereby molding the semiconductor die, the substrate, the wire bonds, the die adapter, the at least one collapsible spacer and the heat spreader into the molding compound to provide a molded package. A ball grid array is formed on a second surface of the substrate, bumps of the ball grid array being electrically connected to the conductive traces and the integrated circuit package is singulated.
REFERENCES:
patent: 5172213 (1992-12-01), Zimmerman
patent: 5311060 (1994-05-01), Rostoker et al.
patent: 5339216 (1994-08-01), Lin et al.
patent: 5444025 (1995-08-01), Sono et al.
patent: 5493153 (1996-02-01), Arikawa et al.
patent: 5610442 (1997-03-01), Schneider et al.
patent: 5639694 (1997-06-01), Diffenderfer et al.
patent: 5650663 (1997-07-01), Parthasarathi
patent: 5679978 (1997-10-01), Kawahara et al.
patent: 5705851 (1998-01-01), Mostafazadeh et al.
patent: 5736785 (1998-04-01), Chiang et al.
patent: 5773362 (1998-06-01), Tonti et al.
patent: 5877552 (1999-03-01), Chiang
patent: 5903050 (1999-05-01), Thurairajaratnam et al.
patent: 5977626 (1999-11-01), Wang et al.
patent: 5986885 (1999-11-01), Wyland
patent: 6037658 (2000-03-01), Brodsky et al.
patent: 6236568 (2001-05-01), Lai et al.
patent: 6251706 (2001-06-01), Paniccia
patent: 6323066 (2001-11-01), Lai et al.
patent: 6414385 (2002-07-01), Huang et al.
patent: 6462405 (2002-10-01), Lai et al.
patent: 6525421 (2003-02-01), Chia et al.
patent: 6631078 (2003-10-01), Alcoe et al.
patent: 6656770 (2003-12-01), Atwood et al.
patent: 6734552 (2004-05-01), Combs et al.
patent: 6849940 (2005-02-01), Chan et al.
patent: 2001/0015492 (2001-08-01), Akram et al.
patent: 2002/0005578 (2002-01-01), Kodama et al.
patent: 2002/0006718 (2002-01-01), Distefano
patent: 2002/0180035 (2002-12-01), Huang et al.
patent: 2002/0185734 (2002-12-01), Zhao et al.
patent: 2003/0034569 (2003-02-01), Caletka et al.
patent: 2003/0075812 (2003-04-01), Cheng et al.
patent: 2003/0160309 (2003-08-01), Punzalan et al.
patent: 100 15 962 (2001-10-01), None
U.S. Appl. No. 10/647,696. Mohan Kirloskar et al., “Improved Ball Grid Array Package and Process for Manufacturing Same”, filed Aug. 25, 2003.
U.S. Appl. No. 10/323,657, Chun Ho Fan et al., “Process for Manufacturing Ball Grid Array Package”, filed Dec. 20, 2002.
U.S. Appl. No. 10/372,421, Joseph Andrew Martin et al., “Improved Ball Grid Array Package”, filed Feb. 24, 2003.
U.S. Appl. No. 10/197,832, Joseph Andrew Martin et al., “Improved Ball Grid Array Package”, filed Jul. 19, 2002.
Fan Chun Ho
Kirloskar Mohan
Labeeb Sadak Thamby
Lam Wing Keung
McLellan Neil
ASAT Ltd.
Morrison & Foerster / LLP
Smoot Stephen W.
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