Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-01-10
2006-01-10
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S713000
Reexamination Certificate
active
06984888
ABSTRACT:
A heat spreader including a plurality of carbonaceous particles present in an amount of at least about 50% by volume of the heat spreader. A non-carbonaceous infiltrant is also present in an amount of at least about 5% by volume of the heat spreader, the non-carbonaceous infiltrant including an element selected from the group consisting of Cu, Al and Ag. In another aspect, the carbonaceous particles may be sintered or fused directly to one another. The heat spreader can be incorporated into a cooling unit for transferring heat away from a heat source, which includes a heat sink with the heat spreader disposed in thermal communication with both the heat sink and the heat source.
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Pizarro-Crespo Marcos D.
Thorpe North & Western LLP
Weiss Howard
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