Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2008-01-01
2008-01-01
Smoot, Stephen W. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Reexamination Certificate
active
07315080
ABSTRACT:
A ball grid array package is manufactured by mounting a semiconductor die to a first surface of a substrate and mounting a die adapter to the semiconductor die. The semiconductor die is wire bonded to ones of conductive traces of the substrate. A collapsible spacer is mounted to the substrate and the substrate is releasably clamped to an upper side of a mold cavity. A heat spreader and at least one collapsible spacer are placed in the mold cavity such that the collapsible spacer is disposed between the heat spreader and the substrate. A molding compound is molded in the mold, thereby molding the semiconductor die, the substrate, the wire bonds, the die adapter, the at least one collapsible spacer and the heat spreader into the molding compound to provide a molded package. A ball grid array is formed on a second surface of the substrate, bumps of the ball grid array being electrically connected to the conductive traces and the integrated circuit package is singulated.
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U.S. Appl. No. 10/647,696. Mohan Kirloskar et al., “Improved Ball Grid Array Package and Process for Manufacturing Same”, filed Aug. 25, 2003.
U.S. Appl. No. 10/323,657, Chun Ho Fan et al., “Process for Manufacturing Ball Grid Array Package”, filed Dec. 20, 2002.
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Fan Chun Ho
Kirloskar Mohan
Labeeb Sadak Thamby
Lam Wing Keung
McLellan Neil
ASAT Ltd.
Morrison & Foerster / LLP
Smoot Stephen W.
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