LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With provision for cooling the housing or its contents

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Ball grid array housing having a cooling foil

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Ball grid array housing having a cooling foil

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Ball grid array package enhanced with a thermal and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Ball grid array package that includes a collapsible spacer...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Ball grid array package that includes a collapsible spacer...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Ball grid array package with conductive leads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Ball grid array package with enhanced thermal and electrical cha

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Patent

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Ball grid array package with inexpensive threaded secure locking

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Ball grid array packages with thermally conductive containers

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Ball grid array type printed wiring board having exellent...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Base for heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Bonding of silicon carbide chip with a semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Patent

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Bypass capacitor embedded flip chip package lid and stiffener

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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