Arrangement having at least one electronic component

Details Arrangement having at least one electronic component Arrangement having at least one electronic component

2011-08-16

2011-08-16

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S720000

Reexamination Certificate

active

07999373

ABSTRACT:
The invention relates to an arrangement comprising at least one electronic component and a cooling body associated therewith. A support physically interposed between the electronic component and the cooling body and the support has at least one layer with at least one material of an electric strength of at least 10 kV/mm and a thermal conductivity of at least 5 W/mK. At least one recess and/or at least one protruding element is arranged in and/or on the layer of the support, and is configured in such a manner that it extends, along the surface of the layer of the support, through preferably all electrically possible pathways between the electronic component and the cooling body as compared to the condition of the layer of the support without the recess and/or without the protruding element.

REFERENCES:
patent: 5576578 (1996-11-01), Fuhrer et al.
patent: 5818101 (1998-10-01), Schuster
patent: 0 785 708 (1997-07-01), None
patent: 10-189803 (1998-07-01), None
patent: 11-243166 (1999-09-01), None
patent: 2003-109972 (2003-04-01), None
patent: 2004-087735 (2004-03-01), None
International Search Report issued Jun. 21, 2007.
Austrain Patent Office Action issued Jan. 19, 2007.

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