LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having multilayer printed wiring board

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having multilayer wiring structure and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having parallel overlapping main current te

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having particular power distribution interc

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having plated contacts and method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having power supply voltage routed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having projecting electrode formed by...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having resin encapsulated package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having resin encapsulated package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having resin encapsulated package...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having resin gate hole through substrate fo

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having semiconductor chip with backside ele

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having shielding structure made of electric

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having step-wise connection structures...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device having wires that vary in wiring pitch

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device in a single package with high wiring densit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device include relay chip connecting...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device including a chip having high-frequency...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor device including a first land on the wiring...