Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-11-07
2009-11-17
Ha, Nathan W (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23023
Reexamination Certificate
active
07619306
ABSTRACT:
A semiconductor device includes a semiconductor substrate, and a plurality of wiring lines provided on one side of the semiconductor substrate, each of the wiring lines having a connection pad portion. An overcoat film is provided on the wiring lines and the one side of the semiconductor substrate, The overcoat film has a plurality of openings in parts corresponding to the connection pad portions of the wiring lines. A plurality of foundation metal layers are respectively provided on inner surfaces of the openings of the overcoat film and electrically connected to the pad portions of the wiring lines. A plurality of projecting electrodes are respectively provided on the foundation metal layers in the openings of the overcoat film.
REFERENCES:
patent: 7429793 (2008-09-01), Yamagata
patent: 2003/0230804 (2003-12-01), Kouno et al.
patent: 2004/0195686 (2004-10-01), Jobetto et al.
patent: 2007/0108606 (2007-05-01), Watanabe
patent: 2008/0191357 (2008-08-01), Kouno et al.
patent: 2006-229113 (2006-08-01), None
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patent: 10-2005-0108308 (2005-11-01), None
Korean Office Action dated Mar. 27, 2009 and English translation thereof issued in a counterpart Korean Application No. 10-2007-0113162.
Casio Computer Co. Ltd.
Frishauf Holtz Goodman & Chick P.C.
Ha Nathan W
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