Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1996-12-17
1997-09-16
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257659, 257660, 257687, 361800, 174 5059, H01L 2348, H01L 23552, H01L 2322, H05K 714
Patent
active
056684061
ABSTRACT:
Disclosed herein is a semiconductor device having shielded structure of an integrated circuit for improving the noise shielding characteristic. The semiconductor device comprises a wiring substrate 100, a recess 101 formed on one main surface of the wiring substrate 100, an IC chip 12 mounted on the recess 101, a resin 13 formed to cover the IC chip 12 and fill the recess 101, a conductive paste 14 formed on the resin 13, a GND pattern 18 formed on the other main surface of the wiring substrate 100, and a through hole 15 formed in the wiring substrate 100 for connecting the GND pattern 18 to the conductive paste 14 electrically.
REFERENCES:
patent: 4680617 (1987-07-01), Ross
patent: 5153379 (1992-10-01), Guzuk et al.
patent: 5166772 (1992-11-01), Soldner et al.
patent: 5466893 (1995-11-01), Nakatani et al.
Clark Jhihan B.
NEC Corporation
Saadat Mahshid D.
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