Semiconductor device in a single package with high wiring densit

Details Semiconductor device in a single package with high wiring densit Semiconductor device in a single package with high wiring densit

1994-08-04

1995-07-18

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257706, 257713, 257796, H01L 2331, H01L 2334, H01L 2348

Patent

active

054344492

ABSTRACT:
There is disclosed a semiconductor device wherein an insulating layer (10) is formed on the reverse face of a lead frame (1), and a heat sink (200) is formed on the reverse face of the insulating layer (10). Transfer molding is carried out such that the reverse face of the heat sink (200) is exposed. The lead frame (1) is insulated from the heat sink (200) by the insulating layer (10). When the semiconductor device is mounted on a conductive external mounting base plate, it is unnecessary to insulate the semiconductor device from the external mounting base plate. This simplifies the process of mounting the semiconductor device on the external mounting base plate.

REFERENCES:
patent: 3753056 (1973-08-01), Cooke
patent: 4067041 (1978-01-01), Hutson
patent: 4352120 (1982-09-01), Kurihara et al.
patent: 4951120 (1990-08-01), Hagiwara et al.
patent: 5049973 (1991-09-01), Satriano et al.
patent: 5105259 (1992-04-01), McShane et al.
patent: 5157478 (1992-10-01), Ueda et al.

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