Semiconductor device including a first land on the wiring...

Details Semiconductor device including a first land on the wiring... Semiconductor device including a first land on the wiring...

2008-08-12

2011-12-13

Mai, Anh (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S690000, C257S784000, C257SE23021

Reexamination Certificate

active

08076770

ABSTRACT:
A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines.

REFERENCES:
patent: 6740964 (2004-05-01), Sasaki
patent: 6828665 (2004-12-01), Pu et al.
patent: 6861288 (2005-03-01), Shim et al.
patent: 7456495 (2008-11-01), Pohl et al.
patent: 2004/0124539 (2004-07-01), Yang et al.
patent: 2007/0045796 (2007-03-01), Ye et al.
patent: 2007/0241437 (2007-10-01), Kagaya et al.
patent: 2009/0096097 (2009-04-01), Kagaya et al.
patent: 2004-56093 (2004-02-01), None
patent: 2004-327855 (2004-11-01), None
patent: 2006-303079 (2006-11-01), None

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