Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-07-22
2008-07-22
Lee, Hsien-ming (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S781000, C257S784000, C257SE23174, C257SE23070, C438S617000, C438S618000
Reexamination Certificate
active
07402904
ABSTRACT:
A semiconductor device includes a first wiring layer having a first wiring pitch and a second wiring layer having a second wiring pitch that differs from the first wiring pitch. The device further includes a third wiring layer which connects the first wiring layer and the second wiring layer and has a wiring incident angle of less than 45 degrees to at least the first wiring layer.
REFERENCES:
patent: 6619785 (2003-09-01), Sato
patent: 2006/0038292 (2006-02-01), Minami et al.
patent: 4-324956 (1992-11-01), None
patent: 8-279602 (1996-10-01), None
patent: 2002-329783 (2002-11-01), None
U.S. Appl. No. 11/756,016, filed May 31, 2007, Saito.
Minami Toshifumi
Oonuki Satoshi
Kabushiki Kaisha Toshiba
Lee Hsien-Ming
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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