LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multilayer wiring substrate for providing a capacitor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multilayer wiring substrate for providing a capacitor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multilayer wiring substrate, semiconductor package, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multilayered integrated circuit with extraneous conductive...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multilayered substrate for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multilayered substrate for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multimode signaling on decoupled input/output and power...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multimode signaling on decoupled input/output and power...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multipackage module having stacked packages with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multiple chip semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multiple layer tape ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multiple line grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multiple pin die package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multiple power/ground planes for tab

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multiprocessor module packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Noise eliminating system on chip and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Noise resistant semiconductor power module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

On-chip power distribution for improved decoupling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Optical semiconductor component with an optically...