Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-07-02
2010-10-19
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S724000
Reexamination Certificate
active
07816779
ABSTRACT:
A multimode system with at least two end points may include a multimode signaling path that, in some embodiments, is a multimode cable or a multimode board and is pluggably connectable to packages at each end point. Each end point may include a processor die package coupled to a socket. The socket may also receive a connector that couples the cable to the package. Power supply signals and input/output signals may be decoupled at each end point.
REFERENCES:
patent: 5892275 (1999-04-01), McMahon
patent: 6646888 (2003-11-01), Cwik et al.
patent: 2005/0078463 (2005-04-01), Chheda et al.
patent: 2006/0043581 (2006-03-01), Prokofiev
patent: 2007/0018307 (2007-01-01), Shinomiya
Braunisch et al., “Flex-Circuit Chip-to-Chip Interconnects”, Proc. IEEE Electronic Components Technol. Conf. (ECTC), San Diego, CA, May 30-Jun. 2, 2006, pp. 1853-1859.
Nguyen et al., “Propagation over multiple parallel transmission lines via modes,” IBM Tech. Disclosure Bull., vol. 32, No. 11, pp. 1-6, Apr. 1990.
Broydé et al., “A new method for the reduction of crosstalk and echo in multiconductor interconnections,” IEEE Trans. Circuits Syst. I, Reg. Papers, vol. 52, No. 2, pp. 405-416, Feb. 2005 [with corrections: vol. 53, No. 8, p. 1851, Aug. 2006].
Braunisch et al., “High-speed flex chip-to-chip interconnect,” in Proc. IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Scottsdale, AZ, Oct. 23-25, 2006, pp. 273-276.
Braunisch et al., “High-speed flex-circuit chip-to-chip interconnects,” IEEE Trans. Adv. Packag., accepted, 2007.
Aygun Kemal
Braunisch Henning
Clark S. V
Intel Corporation
Trop Pruner & Hu P.C.
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