Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-02-06
2007-02-06
Tran, MinhLoan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23011, C257SE23019, C257SE23145, C257SE23069
Reexamination Certificate
active
11171124
ABSTRACT:
A semiconductor device package and method of fabricating the same. The semiconductor device package may include a variety of semiconductor dice, thereby providing a system on a chip solution. The semiconductor dice are attached to connection locations associated with a conductive trace layer such as through flip-chip technology. A plurality of circuit connection elements is also coupled to the conductive trace layer, either directly or through additional, intervening conductive trace layers. An encapsulation layer may be formed over the dice and substrate. Portions of the circuit connection elements remain exposed through the encapsulation layer for connection to external devices. A plurality of conductive bumps may be formed, each conductive bump being disposed atop an exposed portion of a circuit connection element, to facilitate electrical connection with an external device.
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Boon Suan Jeung
Chia Yong Poo
Chua Swee Kwang
Eng Meow Koon
Huang Suangwu
Cruz Leslie Pilar
Micro)n Technology, Inc.
Tran Minh-Loan
TraskBritt
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