Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-04-26
2011-04-26
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23069, C257SE23020, C257SE23052, C257SE25013, C257S734000, C257S762000, C257S766000, C257S758000, C257S773000, C257S686000, C257SE23085, C257SE25023, C257SE21503, C257S782000, C257S786000
Reexamination Certificate
active
07932593
ABSTRACT:
Semiconductor chip packages have die asymmetrically arranged on the respective substrates. Two such packages having complementary arrangements can be stacked, one inverted with respect to the other, such that the two die are situated side-by-side in the space between the two substrates. Also, multipackage modules include stacked packages, each having the die asymmetrically arranged on the substrate. Adjacent stacked packages have complementary asymmetrical arrangements of the die, and one package is inverted with respect to the other in the stack, such that the two die are situated side-by-side in the space between the two substrates. Also, methods are disclosed for making the packages and for making the stacked package modules.
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Stats Chippac Ltd.
Williams Alexander O
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