Multilayer wiring substrate, semiconductor package, and...

Details Multilayer wiring substrate, semiconductor package, and... Multilayer wiring substrate, semiconductor package, and...

2011-07-26

2011-07-26

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S691000, C257SE21499

Reexamination Certificate

active

07986035

ABSTRACT:
A multilayer wiring substrate included in the semiconductor package includes: a first insulating layer and a second insulating layer, in which wiring layers are respectively provided on the upper and the lower surfaces; and; a core layer provided between the first insulating layer and the second insulating layer. The first insulating layer and the second insulating layer are constituted by different materials from each other.

REFERENCES:
patent: 7498522 (2009-03-01), Itoh
patent: 101014225 (2007-08-01), None
patent: 10-294560 (1998-11-01), None
patent: 2001-217514 (2001-08-01), None
patent: 2004-281924 (2004-10-01), None
patent: 2005-038906 (2005-02-01), None
patent: 2007-207781 (2007-08-01), None

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