Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1995-06-07
1998-04-14
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257704, 257680, H01L 2348
Patent
active
057395845
ABSTRACT:
A modular multi-pin package for an integrated circuit die is formed of simple standardized parts and a readily redesigned, integrated circuit specific circuit substrate possessing a design pattern for providing electrical connection between die pads and output pins. The substrate includes a pattern of electrically conductive traces each terminating in a die pattern at an interior portion of the substrate and terminating in a pattern of pin connecting pads at a peripheral portion of the substrate. A pin holding frame is formed with a plurality of holes in which are inserted a selected number and pattern of package terminal pins, each having a shank protruding outwardly from the pin holder for connection to external circuits or components and each having an inner head pressed against one of the pin connecting pads of the substrate circuit traces. A conductive epoxy may be interposed between the pin heads and the substrate pin connecting pads to ensure good electrical contact, and a dielectric gas impermeable adhesive may be employed to secure the pin holder frame to the substrate. A die is inserted through a central aperture of the pin holder frame for attachment to the substrate by connecting the die pads to the die connecting ends of the substrate circuit. The package is completed by bonding a gas impermeable lid of metal or a transparent material to the pin holder frame to cover the opening of the frame and seal the die within the package.
REFERENCES:
patent: 4231154 (1980-11-01), Gazdik et al.
patent: 4979015 (1990-12-01), Stierman et al.
patent: 5288944 (1994-02-01), Bronson et al.
patent: 5506448 (1996-04-01), Morishige
Jerry Lyman "Silicon-On-Silicon Hybrids are Coming into Their Own" May 28, 1987 pp. 47-48.
LSI Logic Corporation
Potter Roy
Thomas Tom
LandOfFree
Multiple pin die package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multiple pin die package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple pin die package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-637861