LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Enhanced leadless chip carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Enhanced via structure for organic module performance

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Enhancement of wire bondability in semiconductor device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Environment-resistant module, micropackage and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Etch stop layer for silicon (Si) via etch in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Externally bondable overmolded package arrangements

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Fabrication of integrated circuits on both sides of a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Fabrication process of semiconductor package and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Face-up semiconductor chip assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Face-up semiconductor chip assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Fan out type wafer level package structure and method of the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Fan out type wafer level package structure and method of the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Fan-out wire structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Film IC with connection terminals

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Film substrate, semiconductor device, method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Flat circuit interconnecting device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Flat multiple-chip module micro ball grid array packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Flexible lead structures and methods of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Flexible rewiring plate for semiconductor components, and...