Flexible rewiring plate for semiconductor components, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Details

C257S688000, C257S759000, C257SE23177, C257SE23165, C257SE23030, C257SE23074, C977S932000, C977S742000

Reexamination Certificate

active

11013851

ABSTRACT:
The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 μm, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connection surfaces, and the carbon nanotubes forming an electrically conductive connection from the contact connection surfaces to the front surface of the base body.

REFERENCES:
patent: 5529950 (1996-06-01), Hoenlein et al.
patent: 5805424 (1998-09-01), Purinton
patent: 2003/0046809 (2003-03-01), Mergenthaler
patent: 2003/0179559 (2003-09-01), Engelhardt et al.
patent: 2003/0211724 (2003-11-01), Haase
patent: 2004/0246650 (2004-12-01), Grigorov et al.
patent: 2006/0091557 (2006-05-01), Sakamoto et al.
patent: 0726621 (1996-08-01), None
patent: 01/57917 (2001-08-01), None

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