Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-09-11
2007-09-11
Jackson, Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S688000, C257S759000, C257SE23177, C257SE23165, C257SE23030, C257SE23074, C977S932000, C977S742000
Reexamination Certificate
active
11013851
ABSTRACT:
The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 μm, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connection surfaces, and the carbon nanotubes forming an electrically conductive connection from the contact connection surfaces to the front surface of the base body.
REFERENCES:
patent: 5529950 (1996-06-01), Hoenlein et al.
patent: 5805424 (1998-09-01), Purinton
patent: 2003/0046809 (2003-03-01), Mergenthaler
patent: 2003/0179559 (2003-09-01), Engelhardt et al.
patent: 2003/0211724 (2003-11-01), Haase
patent: 2004/0246650 (2004-12-01), Grigorov et al.
patent: 2006/0091557 (2006-05-01), Sakamoto et al.
patent: 0726621 (1996-08-01), None
patent: 01/57917 (2001-08-01), None
Beer Gottfried
Dangelmaier Jochen
Haimerl Alfred
Mengel Manfred
Mueller Klaus
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
Jackson Jerome
LandOfFree
Flexible rewiring plate for semiconductor components, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flexible rewiring plate for semiconductor components, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible rewiring plate for semiconductor components, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3778614