Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-10-22
2010-02-23
Zarneke, David A (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23019, C257SE23021
Reexamination Certificate
active
07667318
ABSTRACT:
To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
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Chen Shih-Li
Yang Wen-Kun
Yang Wen-Pin
Advanced Chip Engineering Technology Inc.
Kusner & Jaffe
Zarneke David A
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