Fan-out wire structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Details

C349S149000

Reexamination Certificate

active

07459780

ABSTRACT:
This invention discloses a fan-out wire structure for use in a display panel of a display device. The fan-out wire structure comprises a first metal layer, a first insulation layer, and a second metal layer. The first insulation layer is formed on the first metal layer and the second metal layer is formed on the first insulation layer, and the first metal layer and the second metal layer are electrically connected by a conductive material, so as to modulate the resistance of the fan-out wire structure by modulating the length of the second metal layer and the conductive material.

REFERENCES:
patent: 7113246 (2006-09-01), Yamaguchi et al.
patent: 2005/0124093 (2005-06-01), Yang et al.
patent: 1632650 (2005-06-01), None

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