Flat multiple-chip module micro ball grid array packaging

Details Flat multiple-chip module micro ball grid array packaging Flat multiple-chip module micro ball grid array packaging

1999-03-17

2000-03-07

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257706, 257707, 257708, 257727, 257738, 257778, 257780, 257790, 438122, H01L 2348

Patent

active

060344253

ABSTRACT:
A micro ball grid array package is devised for a multiple-chip module (MCM). The IC chips in the package are butted together to save space. The bonding pads for the lower IC chip or chips are placed along the edges not butted with one another. The bonding pads of the chips are wire-bonded to a printed wiring plate, which has via holes through the printed wiring plate for connection to the ball grid array at the other side of the printed wiring plate and for surface mounting to a printed circuit board. A heat dissipating plate may be placed at the top of the IC chips away from the ball grid array.

REFERENCES:
patent: 4705606 (1987-11-01), Young et al.
patent: 5604978 (1997-02-01), Sherif et al.
patent: 5717245 (1998-02-01), Pedder
patent: 5729051 (1998-03-01), Nakamura
patent: 5777391 (1998-07-01), Nakamura et al.
patent: 5783870 (1998-07-01), Mostafazadet et al.
patent: 5796321 (1998-08-01), Caillat et al.
patent: 5869894 (1999-02-01), Degani et al.
patent: 5894410 (1999-04-01), Barrow
patent: 5900675 (1999-05-01), Appelt et al.
patent: 5914531 (1999-07-01), Tsunoda et al.
patent: 5914535 (1999-07-01), Brandenburgh
patent: 5920117 (1999-07-01), Sono et al.
patent: 5926696 (1999-07-01), Baxter et al.

Affiliated with

Also associated with

Rating

Flat multiple-chip module micro ball grid array packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flat multiple-chip module micro ball grid array packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flat multiple-chip module micro ball grid array packaging will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-365881