Film substrate, semiconductor device, method of...

Details Film substrate, semiconductor device, method of... Film substrate, semiconductor device, method of...

2005-06-28

2005-06-28

Fahmy, Wael (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S666000, C257S667000, C257S691000

Reexamination Certificate

active

06911725

ABSTRACT:
Disclosed is a film substrate comprising an insulative sheet including a first region to be separated, having a slit on an outer peripheral line of the first region, and on which a semiconductor device chip is to be mounted, and a conductive pattern formed on the insulative sheet, crossing the slit, and to be connected to an external terminal of the semiconductor device chip.

REFERENCES:
patent: 5686757 (1997-11-01), Urushima
patent: 6171888 (2001-01-01), Lynch et al.
patent: 3-84955 (1991-04-01), None
patent: 6-53288 (1994-02-01), None
patent: 11-121682 (1999-04-01), None

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