Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1995-04-21
1997-06-03
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257690, 257693, 257696, H01L 2348
Patent
active
056357583
ABSTRACT:
A film integrated circuit includes at least one row of connection terminals to be connected in metallized holes of a given diameter formed in a printed circuit board. The connection terminals have a widened portion, one side with a pocket-like clamping contour to be connected to pads of a film IC, and another side to be connected to the printed circuit board and having a strip-like, comparatively narrower connection piece adjoining the widened portion. At least one of the connection pieces has a V-bend in a bending region forming a spring with one free arm and another arm being connected to the widened portion, for plug contacting in the holes formed in the printed circuit board. The V-bend has a bending radius being markedly smaller than the given diameter of a corresponding one of the holes formed in the printed circuit board. The bent connection pieces have a material thickness in the bending region being reduced by approximately 50%.
REFERENCES:
patent: 5367192 (1994-11-01), Massironi
patent: 5444294 (1995-08-01), Suzuki
patent: 5444299 (1995-08-01), Tsukada et al.
Greenberg Laurence A.
Lerner Herbert L.
Martin Wallace Valencia
Saadat Mahshid D.
Siemens Aktiengesellschaft
LandOfFree
Film IC with connection terminals does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Film IC with connection terminals, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film IC with connection terminals will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-393456