Film IC with connection terminals

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

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Details

257690, 257693, 257696, H01L 2348

Patent

active

056357583

ABSTRACT:
A film integrated circuit includes at least one row of connection terminals to be connected in metallized holes of a given diameter formed in a printed circuit board. The connection terminals have a widened portion, one side with a pocket-like clamping contour to be connected to pads of a film IC, and another side to be connected to the printed circuit board and having a strip-like, comparatively narrower connection piece adjoining the widened portion. At least one of the connection pieces has a V-bend in a bending region forming a spring with one free arm and another arm being connected to the widened portion, for plug contacting in the holes formed in the printed circuit board. The V-bend has a bending radius being markedly smaller than the given diameter of a corresponding one of the holes formed in the printed circuit board. The bent connection pieces have a material thickness in the bending region being reduced by approximately 50%.

REFERENCES:
patent: 5367192 (1994-11-01), Massironi
patent: 5444294 (1995-08-01), Suzuki
patent: 5444299 (1995-08-01), Tsukada et al.

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