LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lithographic contact elements

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Local ground plane for high frequency circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low cost high power hermetic package with electrical feed-throug

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low cost power semiconductor module without substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low cost thermally enhanced semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low cost thermally enhanced semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low inductance bond-wireless co-package for high power...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low inductance conductor topography for MOSFET circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low inductance power distribution system for an integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low inductance power wiring structure and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low noise semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low resistance contact for an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low-capacitance bonding pad for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low-impedance surface-mount device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low-pin-count chip package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low-profile ball-grid array semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

LSI package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

LSI package and manufacturing method thereof