Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-07-29
2008-07-29
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S702000, C257S703000, C257S698000, C257S773000, C257S774000, C257S776000, C257S787000, C257SE23001, C257SE23011, C257S062000, C257SE23069, C257SE23173
Reexamination Certificate
active
07405474
ABSTRACT:
In one embodiment, a device is packaged using a low-cost thermally enhanced ball grid array (LCTE-BGA) package. The device may include a die with its backside mounted to the bottom side of a multi-layer packaging substrate. Thermal vias may be formed through the substrate to allow heat to be conducted away from the backside of the die to a top most metal layer of the substrate. Thermal balls may be attached to the bottom side of the substrate on the same plane as the die.
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Clark Jasmine J
Cypress Semiconductor Corporation
Okamoto & Benedicto LLP
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