Low inductance bond-wireless co-package for high power...

Details Low inductance bond-wireless co-package for high power... Low inductance bond-wireless co-package for high power...

2007-04-11

2009-06-30

Menz, Douglas M (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S577000

Reexamination Certificate

active

07554188

ABSTRACT:
A power semiconductor package that includes at least two semiconductor devices electrically coupled to one another through a common metallic web.

REFERENCES:
patent: 6584681 (2003-07-01), Lorenz et al.
patent: 6836006 (2004-12-01), Muto et al.
International Search Report issued Apr. 10, 2008 in corresponding PCT Application Serial No. PCT/US07/09037.

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