Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1997-05-08
1998-08-11
Wallace, Valencia
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257686, 257692, 257700, 257773, 257777, H01L 2348, H01L 2302, H01L 2312
Patent
active
057931038
ABSTRACT:
A semi-conductor device having a conductive lead with an exposed tip disposed within a first insulative material, which is in turn disposed between insulated first and second integrated circuit chips is disclosed. The first insulative material is etched to form a recess after which a second insulative material is deposited on the access plane of the chips and within the recess. The tip of the wire lead is then exposed by either a chemical mechanical polish or by a wet etch/develop process.
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Daubenspeck Timothy H.
Ference Thomas G.
Holmes Steven J.
Eckert II George C.
International Business Machines - Corporation
Wallace Valencia
Walsh Robert A.
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